In short, no, your T1/DS1 WIC should not be failing "so easily." While just about all (I am not a Ph.D EE so I cannot confidently say "all") semiconductors experience degradation, decay, and aging -- mostly in the dielectric, top-end ASIC and device manufacturers (read: Cisco's enterprise lines) have very high safety margins and lifetimes.
If you are going through T1/DS1 WIC's "so easily" I would look to other causes. See below.
Background -- Skip Ahead if you like
It is rather rare that your DS1 comes off the street and goes straight into your WIC. Generally, the incumbent local exchange carrier (ILEC) (read: last mile copper owner) will terminate your DS1 to a "smart jack" in a shelf (metal box with cards in it). This "smart jack" serves as the physical point of demarcation for the DS1. It can be used to isolate facilities/provider problems from customer premises equipment (CPE) problems.
Most modern metropolitan T1/DS1 circuits are delivered from the central office (CO) to the smart jack as HDSL2/4 -- riding on a single pair. At the smart jack the HDSL turns into traditional B8ZS, ESF two pair DS1 (there are variations). HDSL line voltage can (but shouldn't) approach 200VDC. Traditional T1/DS1 is generally under 3.3VDC. Quite a difference.
If you skipped ahead -- start here
Make sure that the shelf in which the smart jacks live is properly grounded with minimum 6AWG wire. If the shelf has been there a while -- in a high traffic communal telco room there exists the possibility of the grounding wire being bumped or removed.
The smart jacks can build up a lot of extra charge and if there is not a proper ground on the smart jack/shelf it can either damage the smart jack itself or the T1/DS1 WIC behind it.
I have been witness to a handful of smart jacks and T1/DS1 Cisco WIC's failing several times on account of improper grounding of the smart jack/shelf.